1.

Conference Proceedings
Conference Proceedings
1. Mechanical Delamination for the Materials Integration
Henttinen, K. ; Suni, T. ; Nurmela, A. ; Kulawski, M. ; Suni, I.
Pub. info.: Semiconductor wafer bonding : science, technology, and applications : proceedings of the international symposia.  pp.359-367,  2003.  Pennington, NJ.  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 2003-19
2.

Conference Proceedings
Conference Proceedings
2. Effects of Plasma Activation on Hydrophilic Bonding of Si and SiO2
Suni, T. ; Henttinen, K. ; Suni, I. ; Maekinen, J.
Pub. info.: Semiconductor wafer bonding : science, technology, and applications : proceedings of the international symposia.  pp.22-30,  2001.  Pennington, NJ.  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 2001-27