1.

Conference Proceedings
Conference Proceedings
1. Improved Low Temperature Hydrophobic Si-Si Bonding Techniques
Esser, R. ; Hobart, K.D. ; Kub, F.J.
Pub. info.: Semiconductor wafer bonding : science, technology, and applications : proceedings of the international symposia.  pp.126-135,  2001.  Pennington, NJ.  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 2001-27
2.

Conference Proceedings
Conference Proceedings
2. Bonded Polycrystalline SiC Substrates for the Growth and Fabrication of GaN FETs
Hobart, K.D. ; Kub, F.J. ; Esser, R. ; Jernigan, G.G. ; Fatemi, M. ; Binari, S.C. ; Katzer, D.S. ; Dietrich, H.B. ; Kipshidze, G. ; Nikishin, S. ; Temkin, H.
Pub. info.: Semiconductor wafer bonding : science, technology, and applications : proceedings of the international symposia.  pp.92-99,  2001.  Pennington, NJ.  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 2001-27