1.
Conference Proceedings
C. Wang ; W. Lu ; M. Houng ; T. Yen ; Y. Wang
Pub. info.:
State-of-the-Art Program on Compound Semiconductors XLIV . pp.217-221, 2006. Pennington, N.J.. Electrochemical Society
Title of ser.:
ECS transactions
Ser. no.:
2(5)
2.
Conference Proceedings
C. Wang ; M. Liao ; Y. Wang
Pub. info.:
Fringe 2007 : 26-30 November 2007, ESRIN, Frascati, Italy . 2007. Noordwijk, The Netherlands. ESA Communication Production Office
Title of ser.:
ESA SP
Ser. no.:
649
3.
Conference Proceedings
C. Wang ; S. Taniyama ; Y. Wang ; T. Suga
Pub. info.:
Semiconductor Wafer Bonding 10: Science, Technology, and Applications . pp.539-548, 2008. Pennington, NJ. Electrochemical Society
Title of ser.:
ECS transactions
Ser. no.:
16(8)
4.
Conference Proceedings
R.G. Guan ; Z.H. Xing ; L. Shi ; C. Wang ; Y. Wang
Pub. info.:
PRICM 6 : selected, peer reviewed papers from The sixth Pacific Rim International Conference on Advanced Materials and Processing, November 5-9, 2007, ICC Jeju, Jeju Island, Korea . 561-565 pp.865-868, 2007. Uetikon-Zuerich. Trans Tech Publications
Title of ser.:
Materials science forum
Ser. no.:
561-565
5.
Conference Proceedings
Y. Wang ; Y. Yang ; L. Qin ; C. Wang ; D. Yao
Pub. info.:
Optoelectronic Materials and Devices III . 1 pp.71350N-1-71350N-8, 2008. Bellingham, Wash.. Society of Photo-optical Instrumentation Engineers
Title of ser.:
Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.:
7135