1.

Conference Proceedings
Conference Proceedings
1. SOI for Harsh Environment Applications in the USA
Colinge, C.A.
Pub. info.: Progress in SOI structures and devices operating at extreme conditions.  pp.93-104,  2002.  Dordrecht.  Kluwer Academic Publishers
Title of ser.: NATO science series. Series 2, Mathematics, physics and chemistry
Ser. no.: 58
2.

Conference Proceedings
Conference Proceedings
2. UV Activation Treatment for Hydrophobic Wafer Bonding
Dang, H. ; Holl, S.L ; Colinge, C.A. ; Hobart K.D. ; Kub, F.J.
Pub. info.: Semiconductor wafer bonding : science, technology, and applications : proceedings of the international symposia.  pp.376-384,  2005.  Pennington, NJ.  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 2005-02
3.

Conference Proceedings
Conference Proceedings
3. UV/Ozone Activation Treatment for Wafer Bonding
Hobart, K.D. ; Colinge, C.A. ; Ayele, G. ; Kub, F.J.
Pub. info.: Semiconductor wafer bonding : science, technology, and applications : proceedings of the international symposia.  pp.137-143,  2003.  Pennington, NJ.  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 2003-19
4.

Conference Proceedings
Conference Proceedings
4. A Comparison of Interfacial Fracture Energy of Bonded Wafers Using a Micro- Indentation and Crack Propagation Techniques
Colinge, C.A. ; Shaw, M.C. ; Esser, R.H. ; Hobart, K.D.
Pub. info.: Semiconductor wafer bonding : science, technology, and applications : proceedings of the international symposia.  pp.84-91,  2001.  Pennington, NJ.  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 2001-27