1.

Conference Proceedings
Conference Proceedings
1. Recent Results on Advanced Molecular Wafer Bonding Technology for 3D Integration on Silicon
di Cioccio, L. ; Biasse, B. ; Kostrzewa, M. ; Zussy, M. ; Dechamp, J. ; Charlet, B. ; Vinet, M. ; Fedeli, J.M. ; Poiroux, T. ; Lagahe-Blanchard, C. ; Aspar, B. ; Regreny, P. ; Kernevez, N.
Pub. info.: Semiconductor wafer bonding : science, technology, and applications : proceedings of the international symposia.  pp.280-287,  2005.  Pennington, NJ.  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 2005-02
2.

Conference Proceedings
Conference Proceedings
2. Overview on Some Recent Advances in Wafer Bonding Technologies
Moriceau, H. ; Fournel, F. ; Rayssac, O. ; Cartier, A.M. ; Morales, C. ; Pocas, S. ; Zussy, M. ; Jalaguier, E. ; Biasse, B. ; Bataillou, B. ; Papon, A.M. ; Lagahe, C. ; Aspar, B. ; Maleville, C. ; Leterte, F. ; Ghyselen, B. ; Barge, T.
Pub. info.: Semiconductor wafer bonding : science, technology, and applications : proceedings of the international symposia.  pp.1-16,  2001.  Pennington, NJ.  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 2001-27