1.

Conference Proceedings
Conference Proceedings
1. New SiC on insulator wafers based on the Smart-Cut approach and their potential applications
Joly, J.P. ; Aspar, B. ; Bruel, M. ; Di Cioccio, L. ; Letertre, F. ; Hugonnard-Bruyere, E.
Pub. info.: Progress in SOI structures and devices operating at extreme conditions.  pp.31-38,  2002.  Dordrecht.  Kluwer Academic Publishers
Title of ser.: NATO science series. Series 2, Mathematics, physics and chemistry
Ser. no.: 58
2.

Conference Proceedings
Conference Proceedings
2. QuaSiC Smart-Cut Substrates for SiC High Power Devices
Letertre, F. ; Jalaguier, E. ; Di Cioccio, L. ; Templier, F. ; Bluet, J.M. ; Banc, C. ; Matko, I. ; Chenevier, B. ; Bano, E. ; Guillot, G. ; Billon, T. ; Aspar, B. ; Madar, R. ; Ghyselen, B.
Pub. info.: Silicon carbide and related materials 2001 : ICSCRM2001, proceedings of the International Conference on Silicon Carbide and Related Materials 2001, Tsukuba, Japan, October 28-November 2, 2001.  pp.151-154,  2002.  Zuerich, Switzerland.  Trans Tech Publications
Title of ser.: Materials science forum
Ser. no.: 389-393