1.
Technical Paper |
1. An Infrastructure Toward Haptic virtual Assembly with Native 3D Models in Mainstream CAD Systems.
Zhu, W. ; Lee, Y.S.
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2.
Technical Paper |
Zhu, W. ; Curry, J. ; Marquez, A.
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3.
Technical Paper |
Zhu, W. ; Jackman, B.
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4.
Technical Paper |
Ren, Y. ; Zhu, W. ; Lee, Y.-S.
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5.
Technical Paper |
Ren, Y. ; Lee, Y.S. ; Zhu, W.
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6.
Technical Paper |
Zhu, W. ; Lee, Y-S.
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7.
Technical Paper |
Linggen, S. ; Fang, D. ; Xiaotian, T. ; Wang, T. ; Zhu, W.
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