1.

Conference Proceedings
Conference Proceedings
1. Interaction between the Electroless Copper Deposition Solution and the Low-k Fluorinated Dielectrics
Hsu, D.T. ; Tong, H.Y. ; Shi, F.G. ; Lopatin, S. ; Shacham-Diamand, Y. ; Zhao, B. ; Brongo, M. ; Vasudev, P.K.
Pub. info.: Proceedings of the Symposia on Electrochemical Processing in ULSI Fabrication I and Interconnect and Contact Metallization: materials, processes, and reliability.  pp.72-83,  1998.  Pennington, N.J..  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 98-6
2.

Conference Proceedings
Conference Proceedings
2. Compatibility of Low Dielectric Constant Poly (arylether) with the Electroless Copper Deposition Solution
Hsu, D. ; Iskander, M. ; Tong, H.Y. ; Shi, F. ; Lopatin, S. ; Shacham-Diamand, Y. ; Zhao, B. ; Brongo, M. ; Vasudev, P.K.
Pub. info.: Dielectric material integration for microelectronics.  pp.103-112,  1998.  Pennington, NJ.  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 98-3
3.

Conference Proceedings
Conference Proceedings
3. Electroless CoWP Barrier/Protection Layer Deposition for Cu Metallization
Lopatin, S. ; Shacham-Diamand, Y. ; Dubin, V. ; Vasudev, P. K. ; Pellerin, J. ; Zhao, B.
Pub. info.: Electrochemical synthesis and modification of materials : symposium held December 2-5, 1996, Boston, Massachusetts, U.S.A..  pp.463-,  1997.  Pittsburgh, Pa..  MRS - Materials Research Society
Title of ser.: Materials Research Society symposium proceedings
Ser. no.: 451
4.

Conference Proceedings
Conference Proceedings
4. Conformal Electroless Copper Deposition for sub-0.5 μm Interconnect Wiring of Very High Aspect Ratio
Lopatin, S. ; Shacham-Diamond, Y. ; Dubin, V.M. ; Vasudev, P.K. ; Zhao, B. ; Pellerin, J.
Pub. info.: Proceedings of the Third Symposium on Electrochemically Deposited Thin Films.  pp.271-288,  1996.  Pennington, NJ.  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 96-19