1.

Conference Proceedings
Conference Proceedings
1. Bonding and Contacting of MEMS-Structures on Wafer Level
Wiemer, M. ; Fromel, J. ; Jia, C. ; Gessner, T.
Pub. info.: Semiconductor wafer bonding : science, technology, and applications : proceedings of the international symposia.  pp.301-308,  2003.  Pennington, NJ.  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 2003-19
2.

Conference Proceedings
Conference Proceedings
2. Silicon Wafer Bonding for Encapsulating Surface-Micromechanical-Systems using Intermediate Glass Layers
Knechtel, R. ; Heller, J. ; Wiemer, M. ; Fromel, J.
Pub. info.: Semiconductor wafer bonding : science, technology, and applications : proceedings of the international symposia.  pp.321-328,  2003.  Pennington, NJ.  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 2003-19