1.

Conference Proceedings
Conference Proceedings
1. In Situ Electromigration Damage of Al Interconnect Lines and the Influence of Grain Orientation
Buerke, A. ; Wendrock, H. ; Kotter, T. ; Menzel, S. ; Wetzig, K. ; Glasow, A. von
Pub. info.: Materials reliability in microelectronics IX : symposium held April 6-8, 1999, San Francisco, California, U.S.A..  pp.109-,  1999.  Pittsburgh, Pa..  MRS - Materials Research Society
Title of ser.: Materials Research Society symposium proceedings
Ser. no.: 563
2.

Conference Proceedings
Conference Proceedings
2. A Novel Copper Damascene Technique for Power Loaded SAW Structures
Menzel, S. B. ; Albert, M. ; Reitz, D. ; Wendrock, H. ; Schmidt, H. ; Weihnacht, M. ; Wetzig, K. ; Bartha, J. W.
Pub. info.: Materials, integration and packaging issues for high-frequency devices.  pp.129-134,  2004.  Warrendale, Pa..  Materials Research Society
Title of ser.: Materials Research Society symposium proceedings
Ser. no.: 833
3.

Conference Proceedings
Conference Proceedings
3. Effect of Interfaces on Fiber Fracture in Mg and MgLi Matrix Composites
Kudela, S. ; Wendrock, H. ; Kudela, S. Jr. ; Ptacek, L. ; Menzel, S. ; Wetzig, K.
Pub. info.: Materials structure & micromechanics of fracture IV : MSMF-4 : proceedings of the fourth International Conference on Materials Structure & Micromechanics of Fracture, Brno, Czech Republic, June 23-25, 2004.  pp.355-358,  2005.  Uetikon-Zuerich, Switzerland.  Trans Tech Publications
Title of ser.: Materials science forum
Ser. no.: 482