1.

Technical Paper
Technical Paper
1. Characteristics of creep damage for 60Sn-40Pb solder material
Wei, Y. ; Chow, C. L. ; Fang, H. E. ; Neilson, M. K.
Pub. info.: A.S.M.E. paper.  1999.  New York.  The American Society of Mechanical Engineers
Title of ser.: ASME Technical Paper : IMECE/EEP
Ser. no.: 1999
2.

Technical Paper
Technical Paper
2. Analysis of Cumulative Damage in a Bumper Due to Multiple Low Speed Impacts
Chow, C. L. ; Wei, Y. ; Wu, Shen ; Subbaraman, Bala ; Borchelt, James ; Frederick, Gregory
Pub. info.: 2000 SAE world congress : technical paper.  pp.1-10,  2000.  Warrendale, Penn..  Society of Automotive Engineers
Title of ser.: Society of Automotive Engineers technical paper series
Ser. no.: 2000
3.

Technical Paper
Technical Paper
3. Modeling of Tire Rolling Contact Response by REF Model.
Wei, Y.
Pub. info.: 2008 SAE world congress : technical paper.  2008.  Warrendale, Penn..  Society of Automotive Engineers
Title of ser.: Society of Automotive Engineers technical paper series
Ser. no.: 2008