1.

Conference Proceedings
Conference Proceedings
1. Wafer bonding technique for fabricating 1.5-ｦﾌm InGaAs/InGaAsP pillar-free microdisk lasers
Wu,S. ; Wang,L. ; Zhang,J. ; Ho,S.-T.
Pub. info.: Semiconductor Lasers II.  pp.284-286,  1996.  Bellingham, Wash..  SPIE-The International Society for Optical Engineering
Title of ser.: Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.: 2886
2.

Conference Proceedings
Conference Proceedings
2. Deep finlike AIGaAs nanostructure fabricated by CAIBE
Wu,S. ; Wang,L. ; Tiberio,R.C. ; Ho,S.-T.
Pub. info.: Integrated Optoelectronics II.  pp.59-62,  1998.  Bellingham, Wash..  SPIE-The International Society for Optical Engineering
Title of ser.: Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.: 3551
3.

Conference Proceedings
Conference Proceedings
3. Recent advances in microcavity disk lasers and photonic wire lasers
Ho,S.-T. ; Zhang,J.-P. ; Wang,L. ; Wu,S.-L.
Pub. info.: Integrated Optoelectronics.  pp.18-27,  1996.  Bellingham, Wash..  SPIE-The International Society for Optical Engineering
Title of ser.: Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.: 2891