1.

Conference Proceedings
Conference Proceedings
1. Finite-element analysis of solder joint strength in laser diode packaging
Chang,C.-H. ; Sheen,M.-T. ; Kuang,J.-H. ; Chen,C.-C. ; Wang,G.-L. ; Cheng,W.-H. ; Chang,H.-L. ; Wang,S.-C. ; Wang,C. ; Wang,C.-M.
Pub. info.: Optoelectronic Materials and Devices II.  pp.646-651,  2000.  Bellingham, Wash..  SPIE - The International Society for Optical Engineering
Title of ser.: Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.: 4078
2.

Conference Proceedings
Conference Proceedings
2. Finite-element analysis of fiber shifts in fiber-solder-ferrule joints using AuSn solder
Sheen,M.-T. ; Chen,P.-C. ; Kuang,J.-H. ; Wang,G.-L. ; Cheng,W.-H. ; Chang,H.-L. ; Wang,S.-C. ; Wang,C. ; Wang,C.-M.
Pub. info.: Optoelectronic Materials and Devices II.  pp.652-658,  2000.  Bellingham, Wash..  SPIE - The International Society for Optical Engineering
Title of ser.: Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.: 4078
3.

Conference Proceedings
Conference Proceedings
3. Fiber alignment shift in temperature cycling test
Sheu,Y.-C. ; Chen,C.-H. ; Chien,C.-P. ; Kuang,J.-H. ; Chent,W.-H. ; Chang,H.-L. ; Wang,S.-C. ; Wang,C.-M. ; Liaw,J.-W.
Pub. info.: Optoelectronic Materials and Devices.  pp.102-107,  1998.  Bellingham, Wash..  SPIE-The International Society for Optical Engineering
Title of ser.: Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.: 3419
4.

Conference Proceedings
Conference Proceedings
4. Finite element analysis of thermal stresses in laser packaging
Sheen,M.-T. ; Chen,C.-H. ; Kuang,J.-H. ; Cheng,W.-H. ; Chang,H.-L. ; Wang,S.-C. ; Wang,C. ; Wang,C.-M. ; Liaw,J.-W.
Pub. info.: Optoelectronic Materials and Devices.  pp.93-101,  1998.  Bellingham, Wash..  SPIE-The International Society for Optical Engineering
Title of ser.: Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.: 3419