1.

Conference Proceedings
Conference Proceedings
1. Probing Effects of Etching Plasmas on the Properties of Porous Low-k Dielectrics
Wang, L. ; Liu, J. ; Wang, W.D. ; Chi, D.Z. ; Gidley, D.W. ; Yee, A.F.
Pub. info.: Materials, technology and reliability for advanced interconnects and low-k dielectrics - 2004 : symposium held April 13-15, 2004, San Francisco, California, U.S.A..  pp.91-96,  2004.  Warrendale.  Materials Research Society
Title of ser.: Materials Research Society symposium proceedings
Ser. no.: 812
2.

Conference Proceedings
Conference Proceedings
2. Evaluation of PECVD Deposited Boron Nitride as Copper Diffusion Barrier on Porous Low-k Materials
Liu, J. ; Wang, W.D. ; Wang, L. ; Chi, D.Z. ; Loh, K.P.
Pub. info.: Materials, technology and reliability for advanced interconnects and low-k dielectrics - 2004 : symposium held April 13-15, 2004, San Francisco, California, U.S.A..  pp.147-152,  2004.  Warrendale.  Materials Research Society
Title of ser.: Materials Research Society symposium proceedings
Ser. no.: 812