1.

Conference Proceedings
Conference Proceedings
1. IMPACT OF THE ELECTROCHEMICAL PROPERTIES OF SILICON WAFER SURFACES ON COPPER OUTPLATING FROM HF SOLUTIONS
Teerlinck, I. ; Schmidt, H.F. ; Rotondaro, A.L.P. ; Hurd, T.Q. ; Mouche, L. ; Mertens, P.W. ; Meuris, M. ; Heyns, M.M. ; Vanhaeren, D. ; Vandervorst, W.
Pub. info.: Proceedings of the Fourth International Symposium on Cleaning Technology in Semiconductor Device Manufacturing.  pp.284-291,  1995.  Pennington, NJ.  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 95-20
2.

Conference Proceedings
Conference Proceedings
2. THE FORMATION AND REMOVAL OF RESIDUE FORMED DURING TiN FLUOROCARBON PLASMA ETCHING
Kim, Y.B. ; Conard, T. ; Vanhaeren, D. ; Baklanov, M. ; Vanhaelemeersch, S. ; Vandervorst, W. ; Maex, K.
Pub. info.: Proceedings of the Fifth International Symposium on Cleaning Technology in Semiconductor Device Manufacturing.  pp.610-616,  1997.  Pennington, NJ.  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 97-35