1.

Conference Proceedings
Conference Proceedings
1. A High-Voltage Bipolar Process using 6-Inch Direct Bonding Wafer for ASIC Line
Unno, H. ; Imai, K.
Pub. info.: Proceedings of the Fourth International Symposium on Semiconductor Wafer Bonding : science, technology, and applications.  pp.493-500,  1997.  Pennington, NJ.  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 97-36
2.

Conference Proceedings
Conference Proceedings
2. A thin SOI Process Using a Bonding and Etch-Back Method Without Epitaxial Growth
Unno, H. ; Imai, K.
Pub. info.: Proceedings of the Third International Symposium on Semiconductor Wafer Bonding : physics and applications.  pp.191-200,  1995.  Pennington, NJ.  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 95-7