1.

Conference Proceedings
Conference Proceedings
1. Comparative Study Of Cu Seeding Layer By CVD And Electroless Deposition Methods For VLSI CU Interconnect
Tan, K.T. ; Goh, W.L. ; Tse, M.S. ; Liu, K.Y.
Pub. info.: Semiconductor technology (ISTC 2001) : proceedings of the 1st International Conference on Semiconductor Technology.  pp.35-44,  2001.  Pennington, N.J..  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 2001-17
2.

Conference Proceedings
Conference Proceedings
2. Coopper Oxide Removal By In-situ Plasma Pre-Treatment For Improved Copper To Dielectric Barrier Adhesion
Lim, Y.K. ; Goh, W.L. ; Tse, M.S. ; Tse, T.Y. ; Seet, C.S. ; Lu, W. ; Randall ; Cha, C.L. ; Adebanjo, Ricky ; Steiner, Kurt G.
Pub. info.: Semiconductor technology (ISTC 2001) : proceedings of the 1st International Conference on Semiconductor Technology.  pp.55-65,  2001.  Pennington, N.J..  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 2001-17