1.

Conference Proceedings
Conference Proceedings
1. Length Effects On The Reliability Of Dual-Damascene Cu Interconnects
Wei, F. ; Gan, C.L. ; Thompson, C.V. ; Clement, J.J. ; Hau-Riege, S.P. ; Pey, K.L. ; Choi, W.K. ; Tay, H.L. ; Yu, B. ; Radhakrishnan, M.K.
Pub. info.: Silicon materials - processing characterization and reliability : symposium held April 1-5, 2002, San Francisco, California, U.S.A..  pp.645-650,  2002.  Warrendale.  Materials Research Society
Title of ser.: Materials Research Society symposium proceedings
Ser. no.: 716
2.

Conference Proceedings
Conference Proceedings
2. The Effects Of The Mechanical Properties Of The Confinement Material On Electromigration In Metallic Interconnects
Hau-Riege, S.P. ; Thompson, C.V.
Pub. info.: Materials, technology and reliability for advanced interconnects and low-k dielectrics : symposium held April 23-27, 2000, San Francisco, California, U.S.A..  pp.D10.2/G7.2-,  2001.  Warrendale, PA.  Materials Research Society
Title of ser.: Materials Research Society symposium proceedings
Ser. no.: 612
3.

Conference Proceedings
Conference Proceedings
3. Experimental Characterization Of The Reliability Of 3-Terminal Dual-Damascene Copper Interconnect Trees
Gan, C.L. ; Thompson, C.V. ; Pey, K.L. ; Choi, W.K. ; Wei, F. ; Yu, B. ; Hau-Riege, S.P.
Pub. info.: Silicon materials - processing characterization and reliability : symposium held April 1-5, 2002, San Francisco, California, U.S.A..  pp.431-438,  2002.  Warrendale.  Materials Research Society
Title of ser.: Materials Research Society symposium proceedings
Ser. no.: 716
4.

Conference Proceedings
Conference Proceedings
4. Circuit-Level And Layout-Specific Interconnect Reliability Assessments
Hau-Riege, S.P. ; Thompson, C.V. ; Hau-Riege, C.S. ; Andleigh, V.K. ; Chery, Y. ; Troxel, D.
Pub. info.: Materials, technology and reliability for advanced interconnects and low-k dielectrics : symposium held April 23-27, 2000, San Francisco, California, U.S.A..  pp.D2.2-,  2001.  Warrendale, PA.  Materials Research Society
Title of ser.: Materials Research Society symposium proceedings
Ser. no.: 612
5.

Conference Proceedings
Conference Proceedings
5. Experimental Studies Of The Reliability Of Interconnect Trees
Hau-Riege, S.P. ; Thompson, C.V.
Pub. info.: Materials, technology and reliability for advanced interconnects and low-k dielectrics : symposium held April 23-27, 2000, San Francisco, California, U.S.A..  pp.D8.7-,  2001.  Warrendale, PA.  Materials Research Society
Title of ser.: Materials Research Society symposium proceedings
Ser. no.: 612