1.

Conference Proceedings
Conference Proceedings
1. Design Considerations for SI and SIC Layer Transfer by H-Implantation
Tong, Q.-Y. ; Lee, T.-H. ; Huang, L.-J. ; Chao, Y.-L. ; Kim, W.J. ; Scholz, R. ; Tan, T.Y. ; Goesele, U.
Pub. info.: Proceedings of the Fourth International Symposium on Semiconductor Wafer Bonding : science, technology, and applications.  pp.521-528,  1997.  Pennington, NJ.  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 97-36
2.

Conference Proceedings
Conference Proceedings
2. GaAs Layer Splitting by Helium and/or Hydrogen Implantation
Radu, I. ; Szafraniak, I. ; Scholz, R. ; Alexe, M. ; Goesele, U.
Pub. info.: Semiconductor wafer bonding : science, technology, and applications : proceedings of the international symposia.  pp.368-375,  2003.  Pennington, NJ.  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 2003-19
3.

Conference Proceedings
Conference Proceedings
3. Development of Nanovoids at Hydrophilic, Hydrophobic and UHV Bonded Silicon Interfaces
Reznicek, A. ; Scholz, R. ; Senz, S. ; Goesele, U.
Pub. info.: Semiconductor wafer bonding : science, technology, and applications : proceedings of the international symposia.  pp.221-232,  2003.  Pennington, NJ.  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 2003-19
4.

Conference Proceedings
Conference Proceedings
4. UHV-Bonding: Electrical Characterization of Interfaces and Application to Magnetoelectronics
Senz, S. ; Reznicek, A. ; Kumar, A. ; Scholz, R. ; Goesele, U.
Pub. info.: Semiconductor wafer bonding : science, technology, and applications : proceedings of the international symposia.  pp.48-61,  2001.  Pennington, NJ.  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 2001-27
5.

Conference Proceedings
Conference Proceedings
5. Electrical and Structural Investigation of Bonded Silicon Interfaces
Reznicek, A. ; Senz, S. ; Breitenstein, O. ; Scholz, R. ; Goesele, U.
Pub. info.: Semiconductor wafer bonding : science, technology, and applications : proceedings of the international symposia.  pp.114-125,  2001.  Pennington, NJ.  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 2001-27