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Conference Proceedings

1. Analysis of Electromigration in Dual-Damascene Interconnect Structures

R. Lacerda de Orio ; S. Carniello ; H. Ceric ; S. Selberherr

Pub. info.:	Microelectonics Technology and Devices - SBMicro 2008. pp.337-348, 2008. Pennington, N.J.. Electrochemical Society
Title of ser.:	ECS transactions
Ser. no.:	14(1)

Conference Proceedings

2. Three-Dimensional Simulation of Thermal Oxidation and the Influence of Stress

C. Hollauer ; H. Ceric ; S. Selberherr

Pub. info.:	Physics and Chemistry of SiO2 and the Si-SiO2 Interface-5. pp.103-114, 2005. Pennington, N.J.. Electrochemical Society
Title of ser.:	ECS transactions
Ser. no.:	1(1)

Conference Proceedings

3. Electromigration Modeling for Interconnect Structures in Microelectronics

H. Ceric ; S. Selberherr

Pub. info.:	Microelectronics Technology and Devices : SBMICRO 2007. pp.295-304, 2007. Pennington, N.J.. Electrochemical Society
Title of ser.:	ECS transactions
Ser. no.:	9(1)

Conference Proceedings

4. Three-dimensional simulation of sacrificial etching

J. Cervenka ; H. Ceric ; S. Selberherr

Pub. info.:	Smart sensors, actuators, and MEMS III : 2-4 May 2007, Maspalomas, Gran Canaria, Spain. 2007. Bellingham, Wash.. SPIE - The International Society of Optical Engineering
Title of ser.:	Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.:	6589