1.

Conference Proceedings
Conference Proceedings
1. Influence of Dislocations on the Performance of High Indium Content In₀.₈₆Al₀.₁₄As/In₀.₈₆Ga₀.₁₄ As Heterojunction Bipolar Transistors
R. Sandhu ; C. Monier ; A. Cavus ; A. Noori ; S. Hayashi ; R. Hsing ; T. P. Chin ; M. Goorsky ; A. Gutierrez
Pub. info.: State-of-the-Art Program on Compound Semiconductors (SOTAPOCS XLIII) and Nitride and Wide Bandgap Semiconductors for Sensors, Photonics, and Electronics VI.  pp.36-43,  2006.  Pennington, N.J..  Electrochemical Society
Title of ser.: ECS transactions
Ser. no.: 1(2)
2.

Conference Proceedings
Conference Proceedings
2. Chemical Mechanical Polishing of Exfoliated III-V Layers
S. Hayashi ; M. Joshi ; M. Goorsky
Pub. info.: Semiconductor Wafer Bonding 10: Science, Technology, and Applications.  pp.295-302,  2008.  Pennington, NJ.  Electrochemical Society
Title of ser.: ECS transactions
Ser. no.: 16(8)
3.

Conference Proceedings
Conference Proceedings
3. Cleave Engineered Layer Transfer using Porous Silicon
M. Joshi ; S. Hayashi ; S. Hu ; M. Goorsky
Pub. info.: Semiconductor Wafer Bonding 10: Science, Technology, and Applications.  pp.263-270,  2008.  Pennington, NJ.  Electrochemical Society
Title of ser.: ECS transactions
Ser. no.: 16(8)