1.

Conference Proceedings
Conference Proceedings
1. Effect of Temperature on Microstructure and Texture during Compression of AZ31
J. Jiang ; A. Godfrey ; Q. Liu
Pub. info.: Magnesium : Progress in light metals, aerospace materials and superconductors . 2006 BIMW : 2006 Beijing International Materials Week, June 25-30, 2006, Beijing, China.  546-549  pp.245-248,  2007.  Uetikon-Zuerich, Switzerland.  Trans Tech Publications
Title of ser.: Materials science forum
Ser. no.: 546-549(1)
2.

Conference Proceedings
Conference Proceedings
2. Recovery and Recrystallization as a Function of Deformed Microstructure Orientation in Coarse Grained Cold-Rolled Ni
H.S. Chen ; A. Godfrey ; N. Hansen ; Q. Liu
Pub. info.: Recrystallization and grain growth III : proceedings of the Third International Conference on Recrystallization and Grain Growth, ReX & GG III, held in Jeju Island, Korea, June 10-15 2007.  558-559  pp.149-152,  2007.  Stafa-Zuerich.  Trans Tech Publications
Title of ser.: Materials science forum
Ser. no.: 558-559(1)
3.

Conference Proceedings
Conference Proceedings
3. Generation of Initial Microstructures for Monte Carlo Potts Model Simulations of Quasi-Binary Grain Growth
Y.B. Zhang ; A. Godfrey ; M.A. Miodownik ; W. Liu ; Q. Liu
Pub. info.: Recrystallization and grain growth III : proceedings of the Third International Conference on Recrystallization and Grain Growth, ReX & GG III, held in Jeju Island, Korea, June 10-15 2007.  558-559  pp.821-826,  2007.  Stafa-Zuerich.  Trans Tech Publications
Title of ser.: Materials science forum
Ser. no.: 558-559(1)
4.

Conference Proceedings
Conference Proceedings
4. Modeling of Cube-Texture Evolution during Grain Growth in Ni Thick-Films based on Experimental Observations
Y.B. Zhang ; A. Godfrey ; M.A. Miodownik ; W. Liu ; Q. Liu
Pub. info.: Recrystallization and grain growth III : proceedings of the Third International Conference on Recrystallization and Grain Growth, ReX & GG III, held in Jeju Island, Korea, June 10-15 2007.  558-559  pp.1043-1050,  2007.  Stafa-Zuerich.  Trans Tech Publications
Title of ser.: Materials science forum
Ser. no.: 558-559(2)