1.

Conference Proceedings
Conference Proceedings
1. Determining the Effects of Slurry Surfactant, Abrasive Size and Content on the Tribology and Kinetics of Copper CMP
Li, Z. ; Ina, K. ; Lefevrc, P. ; Philipossian, A.
Pub. info.: Chemical Mechanical Planarization : proceedings of the International Symposium.  pp.92-103,  2003.  Pennington, NJ.  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 2003-21
2.

Conference Proceedings
Conference Proceedings
2. Heating and Convection in Copper Polishing
Borucki, L. ; Li, Z. ; Philipossian, A.
Pub. info.: Chemical Mechanical Planarization : proceedings of the International Symposium.  pp.61-67,  2003.  Pennington, NJ.  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 2003-21
3.

Conference Proceedings
Conference Proceedings
3. Comparison of Copper Disc and Copper Wafer Polishing Processes in of Terms their Kinetic, Tribological
Li, Z. ; Rader, S. ; Lefevre, P. ; Ina, K. ; Philipossian, A.
Pub. info.: Chemical Mechanical Planarization : proceedings of the International Symposium.  pp.35-43,  2003.  Pennington, NJ.  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 2003-21