Kwon, Y. ; Jindal, A. ; McMahon, J.J. ; Cale, T.S. ; Gutmann, R.J. ; Lu, J-Q.
Pub. info.:
Thin film materials, processes, and reliability, plasma processing for the 100 nm node and copper interconnects with low-k inter-level dielectric films : proceedings of the international symposium. pp.405-415, 2003. Pennington, N.J.. Electrochemical Society
Lu, J.-Q. ; Jindal, A. ; Kwon, Y. ; McMahon, J.J. ; Lee, K-W. ; Craft, R.P. ; Altemus, B. ; Cheng, D. ; Eisenbraum, E. ; Cale, T.S. ; Gutmann, R.J.
Pub. info.:
Thin film materials, processes, and reliability, plasma processing for the 100 nm node and copper interconnects with low-k inter-level dielectric films : proceedings of the international symposium. pp.381-389, 2003. Pennington, N.J.. Electrochemical Society
Lu, J.-Q. ; Kwon, Y. ; Jindal, A. ; McMahon, J.J. ; Cale, T.S. ; Gutmann, R.J.
Pub. info.:
Semiconductor wafer bonding : science, technology, and applications : proceedings of the international symposia. pp.76-86, 2003. Pennington, NJ. Electrochemical Society
Lu, J.-Q. ; Jindal, A. ; Kwon, Y. ; McMahon, J.J. ; Lee, K.-W. ; Kraft, R.P. ; Altemus, B. ; Cheng, D. ; Eisenbraun, E. ; Cale, T.S. ; Gutmann, R.J
Pub. info.:
Semiconductor wafer bonding : science, technology, and applications : proceedings of the international symposia. pp.87-95, 2003. Pennington, NJ. Electrochemical Society