1.

Conference Proceedings
Conference Proceedings
1. Investigation of Barrier Layers for Cu-Ultra Low-k Porous Polymer Integration
Yang, L.Y. ; Zhang, D.H ; Li, C.Y. ; Foc, P.D. ; Prasad, K. ; Tan, C.M.
Pub. info.: Thin film materials, processes, and reliability, plasma processing for the 100 nm node and copper interconnects with low-k inter-level dielectric films : proceedings of the international symposium.  pp.174-180,  2003.  Pennington, N.J..  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 2003-13
2.

Conference Proceedings
Conference Proceedings
2. Effects Of A Thin Flash Copper Layer On The Diffusion Of Cu, Ta, Si, And O In The Cu/TaN/SiO2/Si Structures
Loh, S.W. ; Zhang, D.H. ; Li, C.Y. ; Liu, R. ; Wee, A.T.S. ; Foo, P.D. ; Xie, Joseph ; Prasad, K. ; Tan, C.M. ; Lee, Y.K.
Pub. info.: Semiconductor technology (ISTC 2001) : proceedings of the 1st International Conference on Semiconductor Technology.  pp.116-122,  2001.  Pennington, N.J..  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 2001-17