1.

Conference Proceedings
Conference Proceedings
1. Reduction of wafer-scale error between DI and FI in multilevel metallization hy adjusting edge detedion method
Bae,S.-G. ; Kim,Y.-K. ; Park,K.-Y. ; Kim,J.-S. ; Lee,W.-G. ; Lee,S.-W. ; Lee,D.-H.
Pub. info.: Metrology, inspection, and process control for microlithography XIV : 28 February - 2 March 2000, San Clara, California.  pp.460-469,  2000.  Bellingham, Wash..  SPIE - The International Society for Optical Engineering
Title of ser.: Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.: 3998
2.

Conference Proceedings
Conference Proceedings
2. Improvement of resist profile roughness in bilayer resist process
Jeong,C.-Y. ; Ryu,S. ; Park,K.-Y. ; Lee,W.G. ; Lee,S.-W. ; Lee,D.-H.
Pub. info.: Advances in resist technology and processing XVII : 28 February - 1 March 2000, Santa Clara, USA.  Part2  pp.818-826,  2000.  Bellingham, Wash..  SPIE - The International Society for Optical Engineering
Title of ser.: Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.: 3999