1.

Conference Proceedings
Conference Proceedings
1. Efficient approach to improving pattern fidelity with multi-OPC model and recipe [6349-182]
Do, M. ; Kang, J. ; Choi, J. ; Lee, J. ; Lee, Y. ; Kim, K. ; Dongbu Electronics (South Korea)
Pub. info.: Photomask Technology 2006.  pp.63494P-,  2006.  Bellingham, Wash..  SPIE - The International Society of Optical Engineering
Title of ser.: Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.: 6349
2.

Conference Proceedings
Conference Proceedings
2. Global pattern density control by resizing fill patterns for CD skew compensation [6283-80]
Shin, J. ; Choi, J. ; Park, S. ; Lee, J. ; Yoo, M. ; Kong, J.
Pub. info.: Photomask and Next-Generation Lithography Mask Technology XIII.  pp.628339-,  2006.  Bellingham, Wash..  SPIE - The International Society of Optical Engineering
Title of ser.: Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.: 6283
3.

Conference Proceedings
Conference Proceedings
3. The effect of sub-layer condition on the OPC model [6349-181]
Choi, J. ; Kang, J. ; Shim, Y. ; Yun, K. ; Lee, J. ; Lee, Y. ; Kim, K.
Pub. info.: Photomask Technology 2006.  pp.63494O-,  2006.  Bellingham, Wash..  SPIE - The International Society of Optical Engineering
Title of ser.: Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.: 6349
4.

Conference Proceedings
Conference Proceedings
4. Chip level lithography verification system with artificial neural networks [5853-98]
Shin, J. ; Choi, J. ; Jung, D. ; Lee, J. ; Yoo, M. ; Kong, J.
Pub. info.: Photomask and Next-Generation Lithography Mask Technology XII.  pp.124-130,  2005.  Bellingham, Wash..  SPIE - The International Society of Optical Engineering
Title of ser.: Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.: 5853