1.
Conference Proceedings |
Y. Wang ; W. Lim ; L. Covert ; T. Anderson ; J. Lin
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2.
Conference Proceedings |
2. Thermal Simulations of 3-D Integrated Multi-Chip Module With GaN Power Amplifier and Si Modulator
T. Anderson ; F. Ren ; L. Covert ; J. Lin ; S. J. Pearton
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