1.
Conference Proceedings |
Y. Wang ; F. Ren ; L. Covert ; J. Lin ; W. Lim
|
|||||||
2.
Conference Proceedings |
2. Thermal Simulations of 3-D Integrated Multi-Chip Module With GaN Power Amplifier and Si Modulator
T. Anderson ; F. Ren ; L. Covert ; J. Lin ; S. J. Pearton
|