1.

Conference Proceedings
Conference Proceedings
1. Wafer Bonding Using Low-k Dielectrics aa Bonding Glue in Three-Dimensional Integration
Kwon, Y. ; Lu, J.-Q. ; Gutmann, R.J. ; Kraft, R.P. ; McDonald, J. ; Cale, T.S.
Pub. info.: Semiconductor wafer bonding : science, technology, and applications : proceedings of the international symposia.  pp.145-154,  2001.  Pennington, NJ.  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 2001-27
2.

Conference Proceedings
Conference Proceedings
2. Wafer Bonding Using Dielectric Polymer Thin Films in 3D Integration
Kwon, Y. ; Lu, J.-Q. ; Kraft, R.P. ; McDonald, J.F. ; Gutmann, R.J. ; Cale, T.S.
Pub. info.: Polymer interfaces and thin films : symposium held November 26-30, 2001, Boston, Massachusetts, U.S.A..  pp.231-238,  2002.  Warrendale, PA.  Materials Research Society
Title of ser.: Materials Research Society symposium proceedings
Ser. no.: 710