1.

Conference Proceedings
Conference Proceedings
1. MICROSTRUCTURE AND ELECTROMIGRATION PROPERTIES OF SUBMICRON Al(.5%Cu) LINES
Prybyla, J. A. ; Kola, R. R. ; Hull, R. ; Eaglesham, D. J. ; Huggins, H. A.
Pub. info.: Mechanisms of thin film evolution.  pp.219-,  1994.  Pittsburgh, PA.  MRS - Materials Research Society
Title of ser.: Materials Research Society symposium proceedings
Ser. no.: 317
2.

Conference Proceedings
Conference Proceedings
2. MICROSTRUCTURAL EVOLUTION AND STRESS RELAXATION IN SPUTTERED TUNGSTEN FILMS
Ross, F. M. ; Kola, R. R. ; Hull, R. ; Bean, J. C.
Pub. info.: Interface control of electrical, chemical, and mechanical properties : symposium held November 29-December 3, 1993, Boston, Massachusetts, U.S.A..  pp.697-,  1994.  Pittsburgh.  MRS - Materials Research Society
Title of ser.: Materials Research Society symposium proceedings
Ser. no.: 318