1.

Conference Proceedings
Conference Proceedings
1. Effect of First Wafer on the CD Bias in DARC/Poly Gate Structure
Chen, L. ; Singh, M. ; Kim, N-H. ; Chu, C. ; Chinn, J.
Pub. info.: Plasma processing XIII : proceedings of the international symposium.  pp.183-197,  2000.  Pennington, N.J..  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 2000-6
2.

Conference Proceedings
Conference Proceedings
2. Development of a High Flow PET Process in HDP Dielectric Etch Systems
Kim, N-H.
Pub. info.: Plasma processing XIII : proceedings of the international symposium.  pp.335-348,  2000.  Pennington, N.J..  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 2000-6
3.

Conference Proceedings
Conference Proceedings
3. Etching of Platinum Thin Films by High Density Ar/Cl2/HBr Plasma
Kim, C-I. ; Kim, N-H. ; Chang, E-G. ; Kwon, K-H. ; Yeom, G-Y. ; Seo, Y-J.
Pub. info.: Advanced interconnects and contact materials and processes for future integrated circuits : symposium held April 13-16, 1998, San Francisco, California, U.S.A..  pp.357-,  1998.  Warrendale, Pa..  MRS - Materials Research Society
Title of ser.: Materials Research Society symposium proceedings
Ser. no.: 514
4.

Conference Proceedings
Conference Proceedings
4. Optimization by Concentration of Oxidizer and Complexing Agent in Cu CMP Slurry
Kim, I.-P. ; Kim, N-H. ; Lim, J.-H. ; Kim, S.-Y. ; Chan, E.-G.
Pub. info.: Chemical Mechanical Planarization : proceedings of the International Symposium.  pp.120-125,  2003.  Pennington, NJ.  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 2003-21