1.

Technical Paper
Technical Paper
1. Modeling and Analysis of Crack Growth in SnPb and SnAgCu Solder Joints in PBGA Packages: Part I- Crack Initiation.
Kim, D. ; Mawer, A. ; Masada, G. Y. ; Moon, T. J.
Pub. info.: A.S.M.E. paper.  2003.  New York, NY.  American Society of Mechanical Engineers
Title of ser.: ASME Technical Paper : IMECE
Ser. no.: 2003
2.

Technical Paper
Technical Paper
2. Modeling and Analysis of Crack Growth in SnPb and SnAgCu Solder Joints in PBGA Packages: Part II- Crack Propagation.
Kim, D. ; Mawer, A. ; Masada, G. Y. ; Moon, T. J.
Pub. info.: A.S.M.E. paper.  2003.  New York, NY.  American Society of Mechanical Engineers
Title of ser.: ASME Technical Paper : IMECE
Ser. no.: 2003