1.

Conference Proceedings
Conference Proceedings
1. Film Thickness Effect on Tensile Properties and Microstructures of Submicron Aluminum Thin Films on Polyimide
Kang, Y. S. ; Ho, P. S. ; Knipe, R. ; Tregilgas, J.
Pub. info.: Thin films, stresses and mechanical properties VI : symposium held April 8-12, 1996, San Francisco, California, U.S.A..  pp.35-,  1997.  Pittsburgh, Pa..  MRS - Materials Research Society
Title of ser.: Materials Research Society symposium proceedings
Ser. no.: 436
2.

Conference Proceedings
Conference Proceedings
2. THE EFFECT OF CURING ON THE THERMOMECHANICAL PROPERTIES OF BPDA-PDA POLYIMIDE THIN FILMS
Leu, J. ; Kang, Y. S. ; Liou, H. C. ; Ho, P. S.
Pub. info.: Electronic packaging materials science VII : symposium held November 29-December 3, 1993, Boston, Massachusetts, U.S.A..  pp.283-,  1994.  Pittsburgh, Pa..  MRS - Materials Research Society
Title of ser.: Materials Research Society symposium proceedings
Ser. no.: 323
3.

Conference Proceedings
Conference Proceedings
3. MORPHOLOGICAL EFFECTS ON THE MATERIALS PROPERTIES OF POLYIMIDES
Poon, T. W. ; Leu, J. ; Kang, Y. S. ; Liou, H. C. ; Ho, P. S.
Pub. info.: Electronic packaging materials science VII : symposium held November 29-December 3, 1993, Boston, Massachusetts, U.S.A..  pp.333-,  1994.  Pittsburgh, Pa..  MRS - Materials Research Society
Title of ser.: Materials Research Society symposium proceedings
Ser. no.: 323