1.

Conference Proceedings
Conference Proceedings
1. SOI Wafer Fabrication by Atomic Layer Cleaving
Current, M.I. ; Malik, I.J. ; Bedell, SW. ; Farrens, S.N. ; Kirk, H. ; Korolik, M. ; Kang, S. ; Fuerfanger, M. ; Henley, F.J.
Pub. info.: High Purity Silicon VI : proceedings of the sixth International Symposium.  pp.516-523,  2000.  Bellingham, Wash..  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 2000-17
2.

Conference Proceedings
Conference Proceedings
2. Atomic-Layer Cleaving for SOI Wafer Fabrication and a Path Towards Laminated Electronics
Current, M.I. ; Malik, I.J. ; Bedell, S.W. ; Kirk, H. ; Korolik, M. ; Kang, S. ; Henley, F.J.
Pub. info.: Silicon-on-Insulator Technology and Devices X : proceedings of the tenth International Symposium.  pp.75-78,  2001.  Pennington, N.J..  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 2001-3