1.

Conference Proceedings
Conference Proceedings
1. The Morphology and Evolution of Cu6Sn5 at the Interface of Sn-2.5Ag-0.7Cu-0.1RE/Cu Solder Joint during the Isothermal Aging
Y.L. Wang ; K.K. Zhang ; C.Y. Li ; L.J. Han
Pub. info.: Physical and Numerical Simulation of Material Processing VI : Selected, peer reviewed papers from the 6th International Conference on Physical and Numerical Simulation of Materials Processing (ICPNS 2010), November 16-19, 2010, Guilin, China.  pp.685-689,  2012.  Aedermannsdorf, Switzerland.  Trans Tech Publications
Title of ser.: Materials science forum
Ser. no.: 704-705
2.

Conference Proceedings
Conference Proceedings
2. Interfacial Microstructures and Kinetics of Sn2.5Ag0.7Cu/Cu
Y.L. Wang ; K.K. Zhang ; C.Y. Li ; L.J. Han ; Q.Z. Zhang
Pub. info.: Functional and electronic materials : selected, peer reviewed papers from IUMRS-ICA 2010, 11th IUMRS International Conference in Asia, 25-28 September 2010, Qingdao, China.  pp.112-116,  2011.  Aedermannsdorf, Switzerland.  Trans Tech Publications
Title of ser.: Materials science forum
Ser. no.: 687