1.

Conference Proceedings
Conference Proceedings
1. Copper Diffusion and Corrosion Behavior Through the Hillock Defect Found Beneath the Weak SiN Dielectric Barrier in Dual Damascene Process
S. Kim ; C. Shim ; J. Hong ; H. Lee ; J. Han ; K. Kim ; Y. Kim
Pub. info.: Dielectrics for nanosystems II: materials science, processing, reliability, and manufacturing.  pp.237-242,  2006.  Pennington, N.J..  Electrochemical Society
Title of ser.: ECS transactions
Ser. no.: 2(1)
2.

Conference Proceedings
Conference Proceedings
2. The optimization of photoresist profile for sub-90nm technology
H. Jeon ; C. Shim ; J. Hong ; J. Han ; K. Kim
Pub. info.: Metrology, inspection, and process control for microlithography XXI.  2007.  Bellingham, Wash..  SPIE - The International Society of Optical Engineering
Title of ser.: Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.: 6518
3.

Conference Proceedings
Conference Proceedings
3. Advanced new OPC method to improve OPC accuracy for sub-90nm technology
J. Choi ; J. Kang ; Y. Shim ; K. Yun ; J. Hong ; Y. Lee ; K. Kim
Pub. info.: Optical microlithography XX.  2007.  Bellingham, Wash..  SPIE - The International Society of Optical Engineering
Title of ser.: Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.: 6520