1.

Conference Proceedings
Conference Proceedings
1. An Easy Method to Measure the Damaged Thickness of Low-k Film after Ash Process
C. Shim ; H. Lim ; S. Jung ; I. Shin ; K. Park ; J. Whang ; H. Lee ; J. Kim ; J. Han ; K. Kim
Pub. info.: Dielectrics for nanosystems II: materials science, processing, reliability, and manufacturing.  pp.243-254,  2006.  Pennington, N.J..  Electrochemical Society
Title of ser.: ECS transactions
Ser. no.: 2(1)
2.

Conference Proceedings
Conference Proceedings
2. 90nm node contact hole patterning through applying model based OPC in KrF lithography
Y.-D. Jeon ; S.-U. Lee ; J. Choi ; J. Kim ; J. Han
Pub. info.: Optical Microlithography XXI.  2  pp.69242W-1-69242W-9,  2008.  Bellingham, Wash..  Society of Photo-optical Instrumentation Engineers
Title of ser.: Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.: 6924
3.

Conference Proceedings
Conference Proceedings
3. Advanced mask technique to improve bit line CD uniformity of 90 nm node flash memory in low-K1 lithography
J. Kim ; J. Choi ; J. Han
Pub. info.: Photomask technology 2008.  1  pp.71220X-1-71220X-6,  2008.  Bellingham, Wash..  Society of Photo-optical Instrumentation Engineers
Title of ser.: Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.: 7122
4.

Conference Proceedings
Conference Proceedings
4. OPC modeling setup with considering flare effect
J. Kim ; J. Choi ; J. Han
Pub. info.: Optical Microlithography XXI.  3  pp.692442-1-692442-8,  2008.  Bellingham, Wash..  Society of Photo-optical Instrumentation Engineers
Title of ser.: Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.: 6924