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Conference Proceedings

1. A STUDY ON SELECTIVE SiGe ETCH FOR THREE-DIMENSIONAL Si STRUCTURE APPLICATIONS

H. Lee ; J. Han ; W. Shim ; C. Hong ; H. Cho ; J. Moon

Pub. info.:	Cleaning Technology in Semiconductor Device Manufacturing IX. pp.201-206, 2006. Pennington, NJ. Electrochemical Society
Title of ser.:	ECS transactions
Ser. no.:	1(3)

Conference Proceedings

2. An Easy Method to Measure the Damaged Thickness of Low-k Film after Ash Process

C. Shim ; H. Lim ; S. Jung ; I. Shin ; K. Park ; J. Whang ; H. Lee ; J. Kim ; J. Han ; K. Kim

Pub. info.:	Dielectrics for nanosystems II: materials science, processing, reliability, and manufacturing. pp.243-254, 2006. Pennington, N.J.. Electrochemical Society
Title of ser.:	ECS transactions
Ser. no.:	2(1)

Conference Proceedings

3. Copper Diffusion and Corrosion Behavior Through the Hillock Defect Found Beneath the Weak SiN Dielectric Barrier in Dual Damascene Process

S. Kim ; C. Shim ; J. Hong ; H. Lee ; J. Han ; K. Kim ; Y. Kim

Pub. info.:	Dielectrics for nanosystems II: materials science, processing, reliability, and manufacturing. pp.237-242, 2006. Pennington, N.J.. Electrochemical Society
Title of ser.:	ECS transactions
Ser. no.:	2(1)

Conference Proceedings

4. 3D profile measurement of large-scale curvature plates using structured light source

E. Heo ; B. Kim ; H. Lee ; J. Han

Pub. info.:	Two- and three-dimensional methods for inspection and metrology VI : 10-11 August 2008, San Diego, California, USA. pp.70660O-1-70660O-8, 2008. Bellingham, Wash.. Society of Photo-optical Instrumentation Engineers
Title of ser.:	Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.:	7066