1.

Conference Proceedings
Conference Proceedings
1. Annealing effects in the delamination of H+ implanted silicon
Hara, T. ; Kakizaki, Y. ; Oshima, S. ; Kitamura, T. ; Kajiyama, K. ; Yoneda, T. ; Sekine, K. ; Inoue, M.
Pub. info.: Proceedings of the Eighth International Symposium on Silicon-on-Insulator Technology and Devices.  pp.33-38,  1997.  Pennington, NJ.  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 97-23
2.

Conference Proceedings
Conference Proceedings
2. Introduction of a die-to-database verification tool for the entire printed geometry of a die: geometry verification system NGR2100 for DFM
Kitamura, T. ; Kubota, K. ; Hasebe, T. ; Sakai, F. ; Nakazawa, S. ; Vohra, N. ; Yamamoto, M. ; Inoue, M.
Pub. info.: Design and process integration for microelectronic manufacturing III : 3-4 March 2005, San Jose, California, USA.  pp.73-84,  2005.  Bellingham, Wash..  SPIE - The International Society of Optical Engineering
Title of ser.: Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.: 5756
3.

Conference Proceedings
Conference Proceedings
3. Introduction of a die-to-database verification tool for the entire printed geometry of a die: geometry verification system NGR2100 for DFM [5853-88]
Kitamura, T. ; Kubota, K. ; Hasebe, T. ; Sakai, F. ; Nakazawa, S. ; Vohra, N. ; Yamamoto, M. ; Inoue, M.
Pub. info.: Photomask and Next-Generation Lithography Mask Technology XII.  pp.988-999,  2005.  Bellingham, Wash..  SPIE - The International Society of Optical Engineering
Title of ser.: Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.: 5853