1.

Conference Proceedings
Conference Proceedings
1. Mechanisms of Low-Temperature Wafer Bending
Reiche, M. ; Radu, I. ; Gabriel, M. ; Zoberbier, M. ; Hansen, S. ; Eichler, M.
Pub. info.: Semiconductor wafer bonding : science, technology, and applications : proceedings of the international symposia.  pp.326-337,  2005.  Pennington, NJ.  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 2005-02
2.

Conference Proceedings
Conference Proceedings
2. Capabilities of an Ambient Pressure Plasma for Activation in LT Wafer Bonding Processes
Gabriel, M. ; Cetin, V. ; Hansen, S. ; Reiche, M. ; Radu, I. ; Eichler, M.
Pub. info.: Semiconductor wafer bonding : science, technology, and applications : proceedings of the international symposia.  pp.50-57,  2005.  Pennington, NJ.  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 2005-02