1.

Conference Proceedings
Conference Proceedings
1. Spreading Kinetics of Molten 60Sn40Pb on Higher Melting Temperature Pb-Sn Alloy Substrates
Conrad, H. ; Guo, Z. ; Jung, D. Y.
Pub. info.: Electronic packaging materials science VIII : symposium held April 17-20, 1995, San Francisco, California, U.S.A..  pp.189-,  1995.  Pittsburgh, Pa..  MRS - Materials Research Society
Title of ser.: Materials Research Society symposium proceedings
Ser. no.: 390
2.

Technical Paper
Technical Paper
2. Plastic deformation kinetics of eutectic Pb-Sn solder joints in monotonic loading and low-cycle fatigue
Guo, Z. ; Sprecher, A. F. ; Conrad, H.
Pub. info.: A.S.M.E. paper.  1991.  New York, NY.  The American Society of Mechanical Engineers
Title of ser.: ASME Technical Paper : WA/EEP
Ser. no.: 1991
3.

Technical Paper
Technical Paper
3. Plastic deformation kinetics of 95.5Sn4Cu0.5Ag solder joints
Guo, Z. ; Conrad, H. ; Pao, Yi-Hsin
Pub. info.: A.S.M.E. paper.  1994.  New York.  The American Society of Mechanical Engineers
Title of ser.: ASME Technical Paper : WA/EEP
Ser. no.: 1994