1.

Conference Proceedings
Conference Proceedings
1. Uniform Growth of (Al)GaAs and InGaP by Multi-wafer Gas-Source MBE System and Its Application to InGaP/GaAs HBTs
Ando, H. ; Okamoto, N. ; Yamaura, S. ; Tomioka, T. ; Takahashi, T. ; Sasa, S. ; Fujii, T.
Pub. info.: Proceedings of the Twenty-first State-of-the-Art Program on Compound Semiconductors (SOTAPOCS XXI).  pp.60-69,  1994.  Pennington, NJ.  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 1994-34
2.

Technical Paper
Technical Paper
2. Feasibility of IGCC Technology for Power Generation in INDIA.
Fujii, T. ; Fujioka, T. ; Morinaga, M. ; Takahashi, T. ; Tokoro, K.
Pub. info.: A.S.M.E. paper.  2004.  New York, NY.  American Society of Mechanical Engineers
Title of ser.: ASME Technical Paper : GT
Ser. no.: 2004
3.

Technical Paper
Technical Paper
3. Development of Management Support System for Gas Turbine Hot Gas Path Parts.
Fujii, T. ; Fujioka, T. ; Morinaga, M. ; Takahashi, T. ; Tokoro, K.
Pub. info.: A.S.M.E. paper.  2004.  New York, NY.  American Society of Mechanical Engineers
Title of ser.: ASME Technical Paper : GT
Ser. no.: 2004
4.

Technical Paper
Technical Paper
4. Development of Actual TBC Exposure Temperature Prediction Method.
Morinaga, M. ; Fujii, T. ; Takahashi, T.
Pub. info.: A.S.M.E. paper.  2004.  New York, NY.  American Society of Mechanical Engineers
Title of ser.: ASME Technical Paper : GT
Ser. no.: 2004
5.

Technical Paper
Technical Paper
5. Numerical Analysis of Temperature Distribution of a Film-Cooled and TBC Coated Blade.
Takahashi, T. ; Watanabe, K. ; Fujii, T. ; Fujioka, T.
Pub. info.: A.S.M.E. paper.  2008.  New York, NY.  American Society of Mechanical Engineers
Title of ser.: ASME Technical Paper : GT
Ser. no.: 2008
6.

Technical Paper
Technical Paper
6. Estimation of Thermophysical properties and microstructure of Aged Thermal Barrier Coatings.
Fujii, T. ; Takahashi, T.
Pub. info.: A.S.M.E. paper.  2001.  New York, NY.  American Society of Mechanical Engineers
Title of ser.: ASME Technical Paper : GT
Ser. no.: 2001