1.

Conference Proceedings
Conference Proceedings
1. The Seamless High Off-Chip Connectivitity (SHOCC) Packaging Technology
Maner, K.U. ; Porter, E.V. ; Schaper, L.W. ; Ang, S.S. ; Brown, W.D.
Pub. info.: Low and High Dielectric Constant Materials : Materials Science, Processing, and Reliability Issues, proceedings of the fourth International Symposium and Thin Film Materials for Advanced Packaging Technologies : proceedings of the second International Symposium.  pp.188-194,  1999.  Pennington, N.J..  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 99-7
2.

Conference Proceedings
Conference Proceedings
2. Characterization of Flexible Thin Film Tantalum Oxide Capacitors
Morcan, G. ; Ang, S.S. ; Brown, W.D. ; Schaper, L.W. ; Lenihan, T.G.
Pub. info.: Dielectric material integration for microelectronics.  pp.241-252,  1998.  Pennington, NJ.  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 98-3
3.

Conference Proceedings
Conference Proceedings
3. Fabrication and Characterization of a High Temperature Superconducting Multichip Module
Cooksey, J.W. ; Brown, W.D. ; Schaper, L.W. ; Florence, R.G. ; Scott, S.S. ; Afonso, S.
Pub. info.: Proceedings of the fourth Symposium on Low Temperature Electronics and High Temperature Superconductivity.  pp.100-107,  1997.  Pennington, NJ.  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 97-2
4.

Conference Proceedings
Conference Proceedings
4. The Flip-Mesh Superconducting MCM
Scott, S.S ; Ang, S.S. ; Brown, W.D. ; Schaper, L.W. ; Afonso, S.
Pub. info.: Proceedings of the fourth Symposium on Low Temperature Electronics and High Temperature Superconductivity.  pp.108-116,  1997.  Pennington, NJ.  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 97-2