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11 results

Conference Proceedings

1. The Seamless High Off-Chip Connectivitity (SHOCC) Packaging Technology

Maner, K.U. ; Porter, E.V. ; Schaper, L.W. ; Ang, S.S. ; Brown, W.D.

Pub. info.:	Low and High Dielectric Constant Materials : Materials Science, Processing, and Reliability Issues, proceedings of the fourth International Symposium and Thin Film Materials for Advanced Packaging Technologies : proceedings of the second International Symposium. pp.188-194, 1999. Pennington, N.J.. Electrochemical Society
Title of ser.:	Electrochemical Society Proceedings Series
Ser. no.:	99-7

Conference Proceedings

2. Characterization of Flexible Thin Film Tantalum Oxide Capacitors

Morcan, G. ; Ang, S.S. ; Brown, W.D. ; Schaper, L.W. ; Lenihan, T.G.

Pub. info.:	Dielectric material integration for microelectronics. pp.241-252, 1998. Pennington, NJ. Electrochemical Society
Title of ser.:	Electrochemical Society Proceedings Series
Ser. no.:	98-3

Conference Proceedings

3. A Highly Adhesive Gold-Based Metallization System for CVD Diamond Substrates

Jahangir, Farhat ; Naseem, H.A. ; Brown, W.D. ; Malshe, A.P. ; Ang, S.S.

Pub. info.:	Diamond materials : proceedings of the sixth international symposium. pp.275-289, 1999. Pennington, N.J.. Electrochemical Society
Title of ser.:	Electrochemical Society Proceedings Series
Ser. no.:	99-32

Conference Proceedings

4. The Flip-Mesh Superconducting MCM

Scott, S.S ; Ang, S.S. ; Brown, W.D. ; Schaper, L.W. ; Afonso, S.

Pub. info.:	Proceedings of the fourth Symposium on Low Temperature Electronics and High Temperature Superconductivity. pp.108-116, 1997. Pennington, NJ. Electrochemical Society
Title of ser.:	Electrochemical Society Proceedings Series
Ser. no.:	97-2

Conference Proceedings

5. Benzocyclobutene/Copper Reliability Study

Yasmeen, N. ; Maner, K. ; Ang, S.S. ; Porter, E.V. ; Ulrich, R.K. ; Brown, W.D.

Pub. info.:	Dielectric material integration for microelectronics. pp.299-312, 1998. Pennington, NJ. Electrochemical Society
Title of ser.:	Electrochemical Society Proceedings Series
Ser. no.:	98-3

Conference Proceedings

6. DEPOSITION OF FLUORINATED SILICON NITRIDE USING PLASMA ENHANCED CHEMICAL VAPOR DEPOSITION TECHNIQUE

Khan, I. ; Naseem, H.A. ; Ang, S.S. ; Brown, W.D.

Pub. info.:	Amorphous silicon technology 1991 : symposium held April 30-May 3, 1991, Anaheim, California, U.S.A.. pp.757-762, 1991. Pittsburgh, Pa.. Materials Research Society
Title of ser.:	Materials Research Society symposium proceedings
Ser. no.:	219

Conference Proceedings

7. WIDE BANDGAP FLUORINATED SILICON-CARBIDE-NITRIDE FILMS USING NP3

Goh, H.C. ; Tan, S.M. ; Naseem, H.A. ; Ang, S.S. ; Brown, W.D.

Pub. info.:	Amorphous silicon technology 1991 : symposium held April 30-May 3, 1991, Anaheim, California, U.S.A.. pp.763-768, 1991. Pittsburgh, Pa.. Materials Research Society
Title of ser.:	Materials Research Society symposium proceedings
Ser. no.:	219

Conference Proceedings

8. HYDROGENATED AMORPHOUS SILICON/ALUMINUM INTERACTION AT LOW TEMPERATURES

Haque, M.S. ; Naseem, H.A. ; Brown, W.D. ; Ang, S.S.

Pub. info.:	Amorphous silicon technology, 1992. pp.1037-1044, 1992. Pittsburgh, Pa.. Materials Research Society
Title of ser.:	Materials Research Society symposium proceedings
Ser. no.:	258

Conference Proceedings

9. Microwave Plasma Deposition of CVD Diamond Films for MEMS Applications

Shaik, A.A. ; Naseem, H.A. ; Brown, W.D. ; Ang, S.S.

Pub. info.:	Diamond materials VII : proceedings of the international symposium. pp.252-263, 2001. Pennington, N.J.. Electrochemical Society
Title of ser.:	Electrochemical Society Proceedings Series
Ser. no.:	2001-25

10.

Conference Proceedings

10. The Effects of Low-Energy Blanket Ion Milling on the Properties of YBCO Superconducting Films

Scott, S.S. ; Ang, S.S. ; Brown, W.D.

Pub. info.:	Proceedings of the Symposium on Low Temperature Electronics and High Temperature Superconductivity. pp.105-112, 1995. Pennington, NJ. Electrochemical Society
Title of ser.:	Electrochemical Society Proceedings Series
Ser. no.:	95-9

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