1.

Conference Proceedings
Conference Proceedings
1. Microtexture And Strain In Electroplated Copper Interconnects
Spolenak, R. ; Barr, D.L. ; Gross, M.E. ; Evans-Lutterodt, K. ; Brown, W.L. ; Tamura, N. ; Macdowell, A.A. ; Celestre, R.S. ; Padmore, H.A. ; Valek, B.C. ; Bravman, J.C. ; Flinn, P. ; Marieb, T. ; Keller, R.R. ; Batterman, B.W. ; Patel, J.R.
Pub. info.: Materials, technology and reliability for advanced interconnects and low-k dielectrics : symposium held April 23-27, 2000, San Francisco, California, U.S.A..  pp.D10.3/G7.3-,  2001.  Warrendale, PA.  Materials Research Society
Title of ser.: Materials Research Society symposium proceedings
Ser. no.: 612
2.

Conference Proceedings
Conference Proceedings
2. Microtexture and Strain in Electroplated Copper Interconnects
Spolenak, R. ; Barr, D.L. ; Gross, M.E. ; Evans-Lutterodt, K. ; Brown, W.L. ; Tamura, N. ; Macdowell, A.A. ; Celestre, R.S. ; Padmore, H.A. ; Valek, B.C. ; Bravman, J.C. ; Flinn, P. ; Marieb, T. ; Keller, R.R. ; Batterman, B.W. ; Patel, J.R.
Pub. info.: Polycrystalline metal and magnetic thin films-2000 : symposium held April 25-27, 2000, San Francisco, California, U.S.A..  pp.G7.3/D10.3-,  2001.  Warrendale, PA.  Materials Research Society
Title of ser.: Materials Research Society symposium proceedings
Ser. no.: 615
3.

Conference Proceedings
Conference Proceedings
3. Grain Orientation And Strain Measurements In Sub-Micron Wide Passivated Individual Aluminum Test Structures
Tamura, N. ; Valek, B.C. ; Spolenak, R. ; MacDowell, A.A. ; Celestre, R.S. ; Padmore, H.A. ; Brown, W.L. ; Marieb, T. ; Bravman, J.C. ; Batterman, B.W. ; Patel, J.R.
Pub. info.: Materials, technology and reliability for advanced interconnects and low-k dielectrics : symposium held April 23-27, 2000, San Francisco, California, U.S.A..  pp.D8.8-,  2001.  Warrendale, PA.  Materials Research Society
Title of ser.: Materials Research Society symposium proceedings
Ser. no.: 612
4.

Conference Proceedings
Conference Proceedings
4. Spatially Resolved Characterization of Electromigration-Induced Plastic Deformation in Al (0.5wt% Cu) Interconnect
Barabash, R.I. ; Ice, G.E. ; Tamura, N. ; Patel, J.R. ; Valek, B.C. ; Bravman, J.C. ; Spolenak, R.
Pub. info.: Spatially resolved characterization of local phenomena in materials and nanostructures : symposium held December 2-5, 2002, Boston, Massachusetts, U.S.A..  pp.345-700,  2003.  Warrendale, Pa..  Materials Research Society
Title of ser.: Materials Research Society symposium proceedings
Ser. no.: 738
5.

Conference Proceedings
Conference Proceedings
5. Coupling Between Precipitation and Plastic Deformation During Electromigration in a Passivated Al (0.5wt%Cu) Interconnect
Barabash, R.I. ; Ice, G.E. ; Tamura, N. ; Valek, B.C. ; Spolenak, R. ; Bravman, J.C. ; Patel, J.R.
Pub. info.: Materials, technology and reliability for advanced interconnects and low-k dielectrics - 2004 : symposium held April 13-15, 2004, San Francisco, California, U.S.A..  pp.351-360,  2004.  Warrendale.  Materials Research Society
Title of ser.: Materials Research Society symposium proceedings
Ser. no.: 812