1.

Conference Proceedings
Conference Proceedings
1. Formation of Silicon Structures by Plasma Activated Wafer Bonding
Amirfeiz, P. ; Bengtsson, S. ; Bergh, M. ; Zanghellini, E. ; Boerjesson, L.
Pub. info.: Semiconductor wafer bonding : science, technology, and applications : proceedings of the international symposia.  pp.29-39,  1999.  Pennington, N.J..  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 99-35
2.

Conference Proceedings
Conference Proceedings
2. Integration of Silicon and Diamond, Aluminum Nitride or Aluminum Oxide for Electronic Materials
Bengtsson, S. ; Bergh, M. ; Soderbarg, A. ; Edholm, B. ; Olsson, J. ; Ericsson, P. ; Tiensuu, S.
Pub. info.: III-V and IV-IV materials and processing challenges for highly integrated microelectronics and optoelectronics : symposium held November 30-December 3, 1998, Boston, Massachusetts, U.S.A..  pp.133-,  1999.  Warrendale, PA.  MRS - Materials Research Society
Title of ser.: Materials Research Society symposium proceedings
Ser. no.: 535
3.

Conference Proceedings
Conference Proceedings
3. The Influence of Surface Micro-Roughness on Bondability
Bergh, M. ; Bengtsson, S. ; Andersson, M.O.
Pub. info.: Proceedings of the Third International Symposium on Semiconductor Wafer Bonding : physics and applications.  pp.126-137,  1995.  Pennington, NJ.  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 95-7