Suder, S.L. ; Hurley, R. ; Li, F.X. ; Bain, M. ; Baine, P. ; MeNeill, D.W. ; Armstrong, B.M. ; Gamble, H.S.
Pub. info.:
Semiconductor wafer bonding : science, technology, and applications : proceedings of the international symposia. pp.19-19, 2001. Pennington, NJ. Electrochemical Society
McCann, P. ; Devine, C. ; Ruddell, F. ; Baine, P. ; Gamble, H.S. ; Nevin, W.A.
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Semiconductor wafer bonding : science, technology, and applications : proceedings of the international symposia. pp.154-165, 2003. Pennington, NJ. Electrochemical Society
Bain, M.F. ; Baine, P. ; McNeill, D.W. ; Srinivasan, G. ; Jankovic, N. ; McCartney, J. ; Moore, R.A. ; Armstrong, B.M. ; Gamble, H.S.
Pub. info.:
Science and technology of semiconductor-on-insulator structures and devices operating in a harsh environment. pp.103-108, 2005. Dordrecht. Kluwer Academic Publishers
Title of ser.:
NATO science series. Series 2, Mathematics, physics and chemistry
Bain, M. ; Stefanos, S. ; Baine, P. ; Loh, S.H. ; Jin, M. ; Montgomery, J.H. ; Armstrong, B.M. ; Gamble, H.S. ; Hamel, J. ; McNeill, D. W. ; Kraft, M. ; Kemhadjian, H.A.
Pub. info.:
Science and technology of semiconductor-on-insulator structures and devices operating in a harsh environment. pp.273-278, 2005. Dordrecht. Kluwer Academic Publishers
Title of ser.:
NATO science series. Series 2, Mathematics, physics and chemistry