1.

Conference Proceedings
Conference Proceedings
1. Two-Step Planarization of ECMP and CMP for MEMS Copper Patterns
S.H. Jeong ; S.B. Joo ; H.J. Lee ; B.Y. Park ; H.J. Kim
Pub. info.: Eco-materials processing and design IX : selected, peer reviewed papers from 9th International Symposium on Eco-Materials Processing and Design, Changwon Convention Centre, Changwon City, Korea, January 07-09, 2008.  pp.117-120,  2008.  Aedermannsdorf, Switzerland.  Trans Tech Publications
Title of ser.: Materials science forum
Ser. no.: 569
2.

Conference Proceedings
Conference Proceedings
2. The Effect of Mixed Abrasive Slurry on CMP of 6H-SiC Substrate
H.J. Lee ; B.Y. Park ; H.S. Lee ; S.H. Jeong ; H.D. Seo
Pub. info.: Eco-materials processing and design IX : selected, peer reviewed papers from 9th International Symposium on Eco-Materials Processing and Design, Changwon Convention Centre, Changwon City, Korea, January 07-09, 2008.  pp.133-136,  2008.  Aedermannsdorf, Switzerland.  Trans Tech Publications
Title of ser.: Materials science forum
Ser. no.: 569