1.

Conference Proceedings
Conference Proceedings
1. Electromigration Failure Modes in CU Metallization*
Gall, M. ; Capasso, C. ; Thrasher, S. ; Zhao, L. ; Muiski, P. ; Hernandez, R. ; Herrick, M. ; Angyal, M. ; Boeck, B. ; Kawasaki, H.
Pub. info.: ULSI Process Integration : proceedings of the International Symposium.  pp.410-425,  2001.  Pennington, N.J..  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 2001-2
2.

Conference Proceedings
Conference Proceedings
2. Integration of Multi-Level Copper Metallization into a High-Performance Sub-0.25 ｦﾌm Technology
Venkatraman, R. ; Jain, A. ; Farkas, J. ; Mendonca, J. ; Hamilton, G. ; Capasso, C. ; Denning, D. ; Simpson, C. ; Rogers, B. ; Frisa, L. ; Ong, T. P. ; Herrick, M. ; Kaushik, V. ; Gregory, R. ; Apen, E. ; Angyal, M. ; Filipiak, S. ; Crabtree, P. ; Sparks, T. ; Anderson, S.
Pub. info.: Advanced interconnects and contact materials and processes for future integrated circuits : symposium held April 13-16, 1998, San Francisco, California, U.S.A..  pp.41-,  1998.  Warrendale, Pa..  MRS - Materials Research Society
Title of ser.: Materials Research Society symposium proceedings
Ser. no.: 514